2023 Touch Taiwan 亮點產品
永光化學今年度以智慧行動(E-Mobility)及永續科技(ESG technology)作為2023 TOUCH Taiwan智慧顯示展兩大主軸,應用產品涵蓋車用觸控顯示器、Micro/Mini LED 顯示器 及 SiC 漿料回收等相對應的化學產品。
2023年展出有別以往,特別增加車用應用題材,及永光化學在下游光學封裝產業提供相關應用材料。
Photoresist for Extra Low Temp. Process
EK 610 / EOC 360
- Negative type photoresist for extra low temperature process. (post bake temp. 85℃)
- For flexible substrate. (COP、PET、PI ,etc.)
- For I-line and broad band exposure equipment.
- High resolution photoresists. (I-line)
Overcoat Photoresist for High Refractive Index Application
EOC 285
- Refractive index (1.70)
- Transmittance (550 nm,95%)
- Good adhesion after stripping resistance test
- Good adhesion after etching resistance test
- Good adhesion after moistures resistance test
FOPLP Photoresist
ECA 100 series
EPP 200 series
EverPI® P09 series
- High Sensitivity
- High Aspect Ratio
- Low curing temperature (180℃)
- High resolution
- Development with 2.38% TMAH
- Good chemical resistance
- Excellent adhesion to substrates
ICP Process Photoresist
EPG 560 series
EPG 5650 series
- Excellent ability to resist dry etching
- Different viscosity and profile shape series to meet a variety of customer needs.
Lift-off Process Photoresist
ENPI 200 series
ENPI 300 series
- Inverted trapezoid profile.
- Can be used in lift-off, rib, anti-dry etching, and other processes.
- Different series of products to meet customer needs.
Photosensitive Polyimide (PSPI)
EverPI® P09 Series
- Development with 2.38% TMAH
- Low curing temperature (180℃)
- Good chemical resistance
- High resolution
Photoresist Stripper
EverSP 200 Series
- NMP & DMSO free
- Water soluble formulation
- Low metal corrosion
Low Reflectivity Ink
IPR Series
- UV or heat-curing process
- Automated production line
- Low reflectivity
LCD black side Sealant
IBR Series
IPR Series
- UV curing process
- Automated production line
- Realize high immersion
LCD PUR Adhesives
IPU Series
- Environment-Friendly Green Adhesives: Conform to ZDHC Regulation
- Energy Saving: Moisture Curing System
- Reactive Hotmelt: Good Green Strength & Bonding Strength
- Good Working Temperature Stability
Compound Semiconductor Substrate Polishing
ESA 301
- Ready to use
- Efficiency
- Regenerable
High Barrier UV-curing Sealants
AB-300 Series
- Solvent-free
- Anti-yellowing
- Elasticity
- Transparency
- Water-vapor blocking
- Substrate compatibility
- Stability (85oC/85%RH@1000hr)
- Room temp. storage