▍Photosensitive Polyimide (PSPI)

1. Low curing temperature (180℃)
2. High resolution
3. Good chemical resistance
4. NMP free

▍Etch Mask

1. High sensitivity
2. Good adhesive
3. Good anti-eaching ability

▍ICP Process Photoresist

Applied to dry etching
1. Excellent ability to resist dry etching
2. Apply to scribe line or mesa process
3. Apply to define tiny lines
4. Low viscosity and high film thickness ease coating pump load
Applied to wet etching and dry etching
1. Vertical profile and high resolution
2. Apply to dry etching or HF wet etching process

▍RDL Photoresist

1. High resolution
2. Strip easily
3. Good anti-plating ability
4. Low dose
5. Wide exposure latitude

▍Photoresist for Plating

1. High Sensitivity
2. High Aspect Ratio

▍Black Photoresist for Ultra-Low Temperature Process

1. Negative black photoresist for 85°C ultra-low temperature curing process
2. Suitable for flexible substrates (e.g., COP, PET, PI, etc.)
3. Compatible with IGH-line or I-line exposure systems
4. Compatible with KOH development system
5. High-resolution capability (5~6 μm line)

▍Lift-off Process Photoresist

1. Overhang can be changed by adjusted process condition
2. Wide PEB latitude
3. Applied to sputter metal or ICP dry etching process
4. Easy to strip

▍White Photoresist for LED / miniLED Reflective Layer

1. Suitable for 140°C ~ 230°C curing process.
2. Used for µLED / miniLED reflective bank layer. (SiNx / Cu)
3. Compatible with IGH-line proximity exposure system.
4. Compatible with KOH development system.
5. High-resolution capability. (35*25 µm via)

▍OC Photoresist for Low Temp. Process

1. Applied to rigid or flexible touch panel design
2. Suitable for OC1 and OC2 Application
3. For low temperature process. (120~140℃)
4. High Surface hardness. (≥3H@500g)
5. Exllenent chemical & moisture resistance
6. Suitable for KOH type developer

▍PLN Photoresist for Optical

1. Applied to CMOS & µLED struture design
2. Suitable for PLN Application
3. For normal temp. process. (230℃)
4. Exllenent moisture resistance.
5. Good transmittance. (>88% @ 400nm)
6. Suitable for TMAH type developer
7. The maximum film thickness is 8 μm

▍UV Adhesive

1. Enviroment Friendly Green Adhesives: Solvent free system
2. Energy Saving : UV curing process
3. Reduce carbon emissions : Automated production line
4. Realize high immersion

▍High Color Purity RGB PR

1. High color purity
2. High transmittance
3. Low exposure
4. High temperature resistant
5. High RSL

▍Low Dk/Df Encapsulant

1. Low viscosity
2. Low dielectric constant and loss
3. High thermal resistance
4. High dimension stability

▍High Barrier UV-curing Encapsulants

1. Solvent-free / Anti-yellowing / Chemical inertness.
2. Protection for moisture-sensitive electronic devices
3. Adhesion for foldable/rigid/composite substrates
4. High transparency in the visible light range
5. UV-curing for energy saving