SEMICON CHINA 2024 Focus

Photoresist for Extra Low Temp. Process

  • EK 610

  • EOC 360

  • Features:

  1. Negative type photoresist for extra low temperature process. (post bake temp. 85℃)
  2. For flexible substrate. (COP、PET、PI ,etc.)
  3. For I-line and broad band exposure equipment.
  4. High resolution photoresists. (I-line)

Overcoat Photoresist for High Refractive Index Application

  • EOC 285

  • Features:

  1. Refractive index (1.70)
  2. Transmittance (550 nm，95%)
  3. Good adhesion after stripping resistance test
  4. Good adhesion after etching resistance test
  5. Good adhesion after moistures resistance test

FOPLP Photoresist

  • ECA 100 Series

  • EPP 200 Series

  • EverPI® P09 Series

  • Features of Photoresist for Plating:

  1. High Sensitivity
  2. High Aspect Ratio

  • Features of Photoresist for Dielectric:

  1. Low curing temperature (180℃)
  2. High resolution
  3. Development with 2.38% TMAH
  4. Good chemical resistance
  5. Excellent adhesion to substrates

ICP Process Photoresist

  • EPG 560 Series

  • EPG 5650 Series

  • Features:

  1. Excellent ability to resist dry etching
  2. Different viscosity and profile shape series to meet a variety of customer needs.

Lift-off Process Photoresist

  • ENPI 200 Series

  • ENPI 300 Series

  • Features:

  1. Inverted trapezoid profile.
  2. Can be used in lift-off, rib, anti-dry etching, and other processes.
  3. Different series of products to meet customer needs.

Photosensitive Polyimide (PSPI)

  • EverPI® P Series

  • EverPI® N Series

  • Features:

  1. Low curing temperature (180℃)
  2. Good chemical resistance
  3. Excellent adhesion to substrates

Photoresist Stripper

  • EverSP 200 Series

  • Features:

  1. NMP & DMSO free
  2. Water soluble formulation
  3. Low metal corrosion

Low Reflectivity Ink

  • IPR Series

  • Features:

  1. UV or heat-curing process
  2. Automated production line
  3. Low reflectivity

LCD black side Sealant

  • IBR Series

  • IPR Series

  • Features:

  1. UV curing process
  2. Automated production line
  3. Realize high immersion

Compound Semiconductor Substrate Polishing

  • ESA 301

  • Features:

  1. Ready to use
  2. Efficiency
  3. Regenerable

I-line Photoresist

  • EPI 630

  • EPI 673

  • EPI 687

  • Features:

  1. High resolution
  2. Excellent etching resistance
  3. High thermal resistance
  4. High photo speed
  5. Wide process margin

Protect film Coating For Laser Dicing

  • HOC 6101

  • Features:

  1. Low curing temperature(60o°C)
  2. High transmittance(T%>98)
  3. Low consumption(low film thickness)
  4. High temperature resistant laser cutting
  5. Acid recasting resistant
  6. Low alkalinity solution stripping

Protect film Remover

  • EGC 70

  • Features:

  1. Low alkalinity(NaOH<2%)
  2. Contains no boron, phosphorus or solvents
  3. Does not corrode metal
  4. Strong cleaning ability(Stripping HOC 6101 Time<60sec)
  5. No residue