▍IC Photoresist

Features
1. High resolution
2. Excellent etching resistance
3. High thermal resistance
4. High photo speed
5. Wide process margin

▍KrF Photoresist

Features
1. Good resolution
2. Large process window

▍ICP Process Photoresist

Applied to dry etching
1. Excellent ability to resist dry etching
2. Apply to scribe line or mesa process
3. Apply to define tiny lines
4. Low viscosity and high film thickness ease coating pump load

Applied to wet etching and dry etching
1. Vertical profile and high resolution
2. Apply to dry etching or HF wet etching process

▍Lift-off Process Photoresist

Features
1. Overhang can be changed by adjusted process condition
2. Wide PEB latitude
3. Applied to sputter metal or ICP dry etching process
4. Easy to strip

▍Photosensitive Polyimide (PSPI)

Features
1. Low curing temperature (180℃)
2. High resolution
3. Good chemical resistance
4. NMP free

▍Black Photoresist for Ultra-Low Temperature Process

Features
1. Negative black photoresist for 85°C ultra-low temperature curing process
2. Suitable for flexible substrates (e.g., COP, PET, PI, etc.)
3. Compatible with IGH-line or I-line exposure systems
4. Compatible with KOH development system
5. High-resolution capability (5~6 μm line)

▍OC Photoresist for Low Temp. Process

Features
1. Applied to rigid or flexible touch panel design
2. Suitable for OC1 and OC2 Application
3. For low temperature process. (120~140℃)
4. High Surface hardness. (≥3H@500g)
5. Exllenent chemical & moisture resistance
6. Suitable for KOH type developer

▍Packaging process photoresist

Features
1. High Sensitivity
2. High Aspect Ratio

▍Electroplating photoresist

Features
Positive type:
1. High Aspect Ratio
2. Strip easily
Negative type:
1. High Sensitivity
2. Excellent anti-plating ability

▍White Photoresist for LED / miniLED Reflective Layer

Features
1. Suitable for 140°C ~ 230°C curing process.
2. Used for µLED / miniLED reflective bank layer. (SiNx / Cu)
3. Compatible with IGH-line proximity exposure system.
4. Compatible with KOH development system.
5. High-resolution capability. (35*25 µm via)

▍Photoresist Stripper

Features
1. NMP & DMSO free
2. Water soluble formulation
3. Low metal corrosion

▍High Barrier UV-curing Encapsulants

Features
1. Solvent-free / Anti-yellowing / Chemical inertness.
2. Protection for moisture-sensitive electronic devices
3. Adhesion for foldable/rigid/composite substrates
4. High transparency in the visible light range
5. UV-curing for energy saving

▍High Color Purity RGB PR

Features
1. High color purity
2. High transmittance
3. Low exposure
4. High temperature resistant
5. High RSL

▍Mass transfer adhesive

Features
1. Prebaking provides effective adhesion.
2. High flatness
3. High adhesion strength
4. Etching after curing
5. High transmittance
6. Low CTE

▍UV Adhesive

Features
1. Enviroment Friendly Green Adhesives: Solvent free system
2. Energy Saving : UV curing process
3. Reduce carbon emissions : Automated production line
4. Realize high immersion

▍Underfill for BGA/CSP

Features
1. Low curing temperatures
2. Good adhesion
3. Good bonding reliability

▍Low Dielectric Loss Encapsulant

Features
1. Low viscosity
2. Low dielectric constant and loss
3. High thermal resistance
4. High dimension stability

▍Protect film Coating For Laser Dicing

Features
1. Low curing temperature(60oC)
2. High transmittance(T%>98)
3. Low consumption(low film thickness)
4. High temperature resistant laser cutting
5. Acid recasting resistant
6. Low alkalinity solution stripping

▍SiC Substrate Planarization Solutions

Features
1. Outstanding removal rate.
2. Easy to post clean, lower particle residue issue.
3. Good surface roughness of Si-face & C-face

▍Sapphire Substrate Polishing Slurry

Features
1. Good surface roughness.
2. Outstanding removal rate.
3. Good suspension and re-dispersibility.