Application of Touch Panel

Everlight Chemical is developing insulator and overcoat of resist for touch panel manufactures. We provide various kinds of characteristic, such as excellent coating uniformity, small dark erosion, excellent surface impedance, excellent adhesion, excellent strippability.

Product Name Advantage Applications Features
EPL 352
Positive Photoresists		 Excellent coating uniformity and excellent adhesion Suitable for slit process and Touch Panel production ◆ Excellent coating uniformity
◆ Small dark erosion
◆ High surface resistance
◆ Excellent adhesion
◆ Excellent removability
EPG 580
Thick Layer Positive Photoresists		 Excellent resistance to HF etching Suitable for slit, spin process and applicable to OGS production ◆ Excellent anti-HF etching
◆ Excellent adhesion
◆ Excellent strippable
Product Name Applications Features
EK 620
High Surface Resistivity Carbon
Black Photoresist
 suitable for OGS
process of touch panel manufacture
  • High surface resistance
  • High sensitivity
  • Excellent surface flatness
  • Excellent adhesion
  • Excellent development margin
  • Good thermal and chemical resistance
SW 5550
High Surface Resistivity Carbon
White Photoresist
 suitable for OGS
process of touch panel manufacture
  • Non-yellowing
  • High surface resistance
  • Excellent surface flatness
  • Excellent adhesion
  • Excellent development margin
  • Good chemical resistance
Product Name Applications Features
EOC 100
Alkaline Developable Negative
Photoresist
 Suitable for photolithography
overcoat photoresist
  • Excellent transmittance
  • Excellent resolution
  • Good chemical resistance
  • Excellent adhesion of etching test
  • Excellent adhesion of rinse test
  • High sensitivity
  • Well development and exposure margin
EOC 200
Alkaline Developable
Negative Photoresist
 Suitable for insulator
layer and overcoat of touch panel manufacture
  • Suitable for OC1 and OC2
  • High surface handness
  • Excelllent transmittance
  • Excellent resolution
  • Good chemical resistance
  • Excellent adhesion of etching test
  • Excellent adhesion of rinse test
  • High sensitivity
  • Well development and exposure margin
EOC 300
Alkaline Developable
Negative Photoresist
 Suitable for On-Cell TP
process of insulator layer and overcoat
  • Excellent adhesion on ITO and TFT glass
  • Excellent transmittance
  • Good chemical resistance
  • Excellent anti side-etching ability
  • Well development and exposure marrgin
Product Name Advantage Applications Features
FSR 110
Positive Photoresist		 High resolution and excellent adhesion of etching
test.		 Suitable for spinless process and applicable to flexible substrate and COF production. ◆ Flexible substrate
◆ High resolution
◆ High sensitivity
◆ Excellent adhesion of etching test
◆ Wide process margin
◆ Developable in KOH or Na2CO3 solution
Product Name Type Applications Features Remarks
ENPD 22 & 23
Highly Concentrated Inorganic Aqueous Alkaline Developers
 KOH type formulated for use with negative type photoresist, and provide excellent development ．Wide latitude for development process
．Low foam bubbles formed during process
．Highly concentrated solution with easy
handling		 The alkali is concentrated, it must be diluted the straight developer with DI water before using, 1:50 for ENPD 22 and 1:100 for ENPD 23.
ENPD 72 ENPD 80
Highly Concentrated Inorganic Aqueous Alkaline Developer
 Buffer type formulated for use with negative type photoresist, and provide excellent development ．Wide latitude for development process
．Low foam bubbles formed during process
．Highly concentrated solution with easy
handling		 The developer is concentrated, it must be diluted with DI water before using, 1:19 for ENPD 72 and 1:9 for ENPD 80.
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