IC Manufacturing
We offer a comprehensive range of G-line, I-line, and thick-film photoresists, widely used in photolithography processes across the semiconductor and packaging industries, as well as photoresist developers and other related products.
Dedicated to creating value with our customers, we ensure consistent product quality through manufacturing in a tightly controlled cleanroom environment, supported by advanced analytical instruments, to better serve our expanding customer base.
▍EPG 510 Positive Photoresists
EPG 510 Series with high sensitivity and good heat resistance are positive photoresists excellent for IC applications.
- High sensitivity
- Excellent adhesion
- Excellent thermal resistance
- Wide process margin
▍EPG 530 Positive Photoresists
EPG 530 Series with high sensitivity and good heat resistance are positive photoresists excellent for IC applications.
- High Resolution
- Excellent adhesion
- Excellent thermal resistance
- Wide process margin
▍EPG 550 Positive Photoresists
EPG 550 is a positive photoresist with high resolution and excellent metal layer anti-reflection for G-line metal layer production.
- High resolution
- Excellent anti-reflection ability on the metal layer
▍EPG 590 Thick Layer Positive Photoresists
EPG 590 Series are thick layer positive photoresists applicable to bumping manufactures.
- Good chemical resistance
- High viscosity
- Excellent adhesion
- Plating process application