IC Manufacturing
We offer a comprehensive range of G-line, I-line, and thick-film photoresists, widely used in photolithography processes across the semiconductor and packaging industries, as well as photoresist developers and other related products.
Dedicated to creating value with our customers, we ensure consistent product quality through manufacturing in a tightly controlled cleanroom environment, supported by advanced analytical instruments, to better serve our expanding customer base.
Photosensitive Polyimide (PSPI) is an essential insulating and protective material in advanced packaging, streamlining semiconductor manufacturing by integrating photoresist and insulation functions into a single layer. Historically, traditional negative PSPI was widely adopted for its thermal and mechanical robustness. Over the years, however, next-generation positive PSPI has gained prominence in advanced packaging and high-end display industries, offering finer resolution, low-temperature curing, and eco-friendly water-based development.
▍EverPI® P Series
EverPI® P09
EverPI® P91
EverPI® P93
EverPI® P95
EverPI® P99
▍EverPI® N Series
EverPI® N1301
EverPI® N2301
- Insulator Layer
- Passivation Layer
- Low curing temperature (180℃)
- High resolution
- Good chemical resistance
- NMP free
| Item | Positive EverPI® P09 | Negative EverPI® N1301 | Negative EverPI® N2301 |
|---|---|---|---|
| Developer | 2.38% TMAH | Cyclopentanone | 2.38% TMAH |
| Viscosity (cP) | 15 ~ 1200 | 2000~3000 | 15~650 |
| Film Thickness (μm) | 1 ~ 20 | 6~15 | 1~10 |
| Elongation (%) | ＞ 30 | ＞ 50 | ＞ 70 |
| Tensile Strength (MPa) | ＞ 110 | ＞ 130 | ＞ 130 |
| Dielectric Constant (10GHz) | 3.7~3.5 | 3.1~3.2 | 3.3~3.5 |
| CTE (ppm/℃) | 40 ~ 50 | 60~70 | 60~70 |
| Breakdown Voltage (V/μm) | ＞ 350 | ＞ 350 | ＞ 350 |
