LED Manufacturing
We provides photoresists suitable for lift-off process and pss (Pattern Sapphire Substrate) process. We also provides a full array of related materials, including wafer polish slurries and developer. Due to our commitment to customer service, we developed technologies of ultra-clean manufacturing pp-level analysis and microlithography to ensure the quality of our products.
| Product Name | Applications | Features |
|---|---|---|
| EPG 516 Positive Photoresists | Applicable to LED manufactures | • High sensitivity
• Excellent adhesion • Excellent thermal resistance • Wide proess margin |
| EPG 527 Positive Photoresists |
EPG 527 has excellent adhesion and good etching resistance which is applicable to LED manufactures. | • Good etching resistance
• Excellent adhesion • Excellect strippable |
| EPG 560 Thick Layer Positive Photoresists |
Applicable to ICP dry-etching process | • High sensitivity
• Good ICP dry etching resistance • Good thermal resistance |
| ENPI 200 Alkali Developable Negative Photoresists |
Applicable to lift-off process | • Excellent adhesion
• Excellect strippable • Based on safety-solvent |
| Product Name | Application | Features |
|---|---|---|
| EPI 612 High Resolution Positive Photoresist |
Applicable to LED Pattern Sapphire Substrate (PSS) manufactures |
• High sensitivity
• High resolution • Excellent adhesion • Wide process margin • Good uniformity |
| Product Name | Description | Application | Features |
|---|---|---|---|
| ESR 236 | Highly dispersed colloidal silica abrasives with special formulation | With 20~40 times water dilution , delivers a high-removal-rate and damage-free surface for primary and secondary polishing silicon wafers, thereby can reduce the producing costs and raise the process yield. | • High-removal-rate
• Prolong pad lifetime • Suitable for both non-circulating and circulating system |
| ESS 020 | Highly dispersed colloidal silica abrasives with special formulation | Primary and secondary polish of silicon wafers and silicon materials. | • High-removal-rate
• Prolong pad lifetime • Suitable for both non-circulating and circulating system • High dilution application |
| ESS 100 | Highly dispersed colloidal silica abrasives with special formulation | Stock polish of silicon wafers and silicon materials. | • High-removal-rate
• Prolong pad lifetime • Suitable for both non-circulating and • High dilution application |
| Product Name | Description | Application | Features |
|---|---|---|---|
| ESR 500 | Highly dispersed colloidal silica abrasives with special formulation | For sapphire substrate Polishing | • High-removal-rate
• Wide process window and high stability • Perfect surface quality |
| ESR 600 | Highly dispersed colloidal silica abrasives with special formulation | For Sapphire (A-plane) polishing, application for cover lens of cell phone and watch. | • Designed for sapphire A-plane
• Removal rate is 50% higher than competitor |
| ESA 280 | Highly dispersed colloidal silica abrasives with special formulation | For sapphire substrate polishing with high removal rate | • Good suspension
• High Dilution application • Re-dispersibility for work • Good surface roughness ( Ra < 0.3 nm) • Outstanding removal rate |
| Product Name | Description | Application | Features |
|---|---|---|---|
| ESA 220 | Good dispersed alumina abrasives with special formulation | For AlN substrate polishing. And can be used for metal materials stock removal polishing | • Good suspension / re-dispersibility for work
• Designed for recirculating polishing • Good surface quality |
| Product Name | Description | Application | Features |
|---|---|---|---|
| ESR 131 | Excellent uniform and highly dispersed colloidal silica abrasives with special formulation | Alloy, stainless steel polishing | • Damage free surface
• High removal rate • Easy to post clean after polishing process |
| ESA 220 | Good dispersed alumina abrasives with special formulation | For AlN substrate polishing. And can be used for metal materials stock removal polishing | • Good suspension / re-dispersibility for work
• Designed for recirculating polishing • Good surface quality |
| Product Name | Description | Application | Features |
|---|---|---|---|
| ESA 300 | Good dispersed alumina abrasives with special formulation | For SiC substrate polishing with high removal rate | • Good suspension
• High Dilution • Re-dispersibility for work • Good surface roughness ( Ra < 0.1 nm) • Outstanding removal rate |
– Other Product –