LED Manufacturing

We provides photoresists suitable for lift-off process and pss (Pattern Sapphire Substrate) process. We also provides a full array of related materials, including wafer polish slurries and developer. Due to our commitment to customer service, we developed technologies of ultra-clean manufacturing pp-level analysis and microlithography to ensure the quality of our products.

Product Name Applications Features
EPG 516 Positive Photoresists Applicable to LED manufactures • High sensitivity

• Excellent adhesion

• Excellent thermal resistance

• Wide proess margin

EPG 527
Positive Photoresists
EPG 527 has excellent adhesion and good etching resistance which is applicable to LED manufactures. • Good etching resistance

• Excellent adhesion

• Excellect strippable

EPG 560
Thick Layer Positive Photoresists
Applicable to ICP dry-etching process • High sensitivity

• Good ICP dry etching resistance

• Good thermal resistance

ENPI 200
Alkali Developable Negative Photoresists
Applicable to lift-off process •  Excellent adhesion

• Excellect strippable

• Based on safety-solvent

Product Name Application Features
EPI 612
High Resolution Positive Photoresist
Applicable to LED Pattern Sapphire
Substrate (PSS) manufactures
• High sensitivity

• High resolution

• Excellent adhesion

• Wide process margin

• Good uniformity

Product Name Description Application Features
ESR 236 Highly dispersed colloidal silica abrasives with special formulation With 20~40 times water dilution , delivers a high-removal-rate and damage-free surface for primary and secondary polishing silicon wafers, thereby can reduce the producing costs and raise the process yield. • High-removal-rate

• Prolong pad lifetime  

• Suitable for both non-circulating and circulating system

ESS 020 Highly dispersed colloidal silica abrasives with special formulation Primary and secondary polish of silicon wafers and silicon materials. • High-removal-rate

Prolong pad lifetime

• Suitable for both non-circulating and circulating system

• High dilution application

ESS 100 Highly dispersed colloidal silica abrasives with special formulation Stock polish of silicon wafers and silicon materials. • High-removal-rate

• Prolong pad lifetime

• Suitable for both non-circulating and
circulating system

• High dilution application

Product Name Description Application Features
ESR 500 Highly dispersed colloidal silica abrasives with special formulation For sapphire substrate Polishing • High-removal-rate

• Wide process window and high stability

• Perfect surface quality

ESR 600 Highly dispersed colloidal silica abrasives with special formulation For Sapphire (A-plane) polishing, application for cover lens of cell phone and watch. • Designed for sapphire A-plane

• Removal rate is 50% higher than competitor

ESA 280 Highly dispersed colloidal silica abrasives with special formulation For sapphire substrate polishing with high removal rate • Good suspension

• High Dilution application

• Re-dispersibility for work

• Good surface roughness ( Ra < 0.3 nm)

• Outstanding removal rate

Product Name Description Application Features
ESA 220 Good dispersed alumina abrasives with special formulation For AlN substrate polishing. And can be used for metal materials stock removal polishing • Good suspension / re-dispersibility for work

• Designed for recirculating polishing

• Good surface quality

Product Name Description Application Features
ESR 131 Excellent uniform and highly dispersed colloidal silica abrasives with special formulation Alloy, stainless steel polishing • Damage free surface

• High removal rate

• Easy to post clean after polishing process

ESA 220 Good dispersed alumina abrasives with special formulation For AlN substrate polishing. And can be used for metal materials stock removal polishing • Good suspension / re-dispersibility for work

• Designed for recirculating polishing

• Good surface quality

Product Name Description Application Features
ESA 300 Good dispersed alumina abrasives with special formulation For SiC substrate polishing with high removal rate • Good suspension

• High Dilution

• Re-dispersibility for work

• Good surface roughness ( Ra < 0.1 nm)

• Outstanding removal rate

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