{"id":823,"date":"2023-04-17T17:02:40","date_gmt":"2023-04-17T09:02:40","guid":{"rendered":"https:\/\/ecbu.ecic.com\/2023touchtaiwan-focus\/"},"modified":"2024-03-20T16:07:15","modified_gmt":"2024-03-20T08:07:15","slug":"2023touchtaiwan-focus","status":"publish","type":"page","link":"https:\/\/ecbu.ecic.com\/en\/2023touchtaiwan-focus\/","title":{"rendered":"SEMICON CHINA 2024 Focus"},"content":{"rendered":"

SEMICON CHINA 2024 Focus<\/p><\/h1><\/div><\/div><\/div><\/div><\/div>

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Photoresist for Extra Low Temp. Process<\/span><\/h3>\n<\/div>
  • <\/i><\/span>
    \n

    EK 610<\/p>\n<\/div><\/li>

  • <\/i><\/span>
    \n

    EOC 360<\/p>\n<\/div><\/li><\/ul><\/div><\/div><\/div><\/div><\/div>

    • <\/i><\/span>
      \n

      Features:<\/h4>\n<\/div><\/li><\/ul>
        \n
      1. Negative type photoresist for extra low temperature process. (post bake temp. 85\u2103)<\/li>\n
      2. For flexible substrate. (COP\u3001PET\u3001PI ,etc.)<\/li>\n
      3. For I-line and broad band exposure equipment.<\/li>\n
      4. High resolution photoresists. (I-line)<\/li>\n<\/ol>\n<\/div><\/div><\/div>
        <\/div><\/div><\/div><\/div><\/div><\/div>

        Overcoat Photoresist for High Refractive Index Application<\/span><\/h3>\n<\/div>
        • <\/i><\/span>
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          EOC 285<\/p>\n<\/div><\/li><\/ul><\/div><\/div><\/div><\/div><\/div>

          • <\/i><\/span>
            \n

            Features:<\/h4>\n<\/div><\/li><\/ul>
              \n
            1. Refractive index (1.70)<\/li>\n
            2. Transmittance (550 nm\uff0c95%)<\/li>\n
            3. Good adhesion after stripping resistance test<\/li>\n
            4. Good adhesion after etching resistance test<\/li>\n
            5. Good adhesion after moistures resistance test<\/li>\n<\/ol>\n<\/div><\/div><\/div>
              <\/div><\/div><\/div><\/div><\/div><\/div>

              FOPLP Photoresist<\/span><\/h3>\n<\/div>
              • <\/i><\/span>
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                ECA 100 Series<\/p>\n<\/div><\/li>

              • <\/i><\/span>
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                EPP 200 Series<\/p>\n<\/div><\/li>

              • <\/i><\/span>
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                EverPI\u00ae P09 Series<\/p>\n<\/div><\/li><\/ul><\/div><\/div><\/div><\/div><\/div>

                • <\/i><\/span>
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                  Features of Photoresist for Plating:<\/h4>\n<\/div><\/li><\/ul>
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                  1. High Sensitivity<\/li>\n
                  2. High Aspect Ratio<\/li>\n<\/ol>\n<\/div>
                    • <\/i><\/span>
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                      Features of Photoresist for Dielectric:<\/h4>\n<\/div><\/li><\/ul>
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                      1. Low curing temperature (180\u2103)<\/li>\n
                      2. High resolution<\/li>\n
                      3. Development with 2.38% TMAH<\/li>\n
                      4. Good chemical resistance<\/li>\n
                      5. Excellent adhesion to substrates<\/li>\n<\/ol>\n<\/div><\/div><\/div>
                        <\/div><\/div><\/div><\/div><\/div><\/div>

                        ICP Process Photoresist<\/span><\/h3>\n<\/div>
                        • <\/i><\/span>
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                          EPG 560 Series<\/p>\n<\/div><\/li>

                        • <\/i><\/span>
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                          EPG 5650 Series<\/p>\n<\/div><\/li><\/ul><\/div><\/div><\/div><\/div><\/div>

                          • <\/i><\/span>
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                            Features:<\/h4>\n<\/div><\/li><\/ul>
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                            1. Excellent ability to resist dry etching<\/li>\n
                            2. Different viscosity and profile shape series to meet a variety of customer needs.<\/li>\n<\/ol>\n<\/div><\/div><\/div>
                              <\/div><\/div><\/div><\/div><\/div><\/div>

                              Lift-off Process Photoresist<\/span><\/h3>\n<\/div>
                              • <\/i><\/span>
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                                ENPI 200 Series<\/p>\n<\/div><\/li>

                              • <\/i><\/span>
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                                ENPI 300 Series<\/p>\n<\/div><\/li><\/ul><\/div><\/div><\/div><\/div><\/div>

                                • <\/i><\/span>
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                                  Features:<\/h4>\n<\/div><\/li><\/ul>
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                                  1. Inverted trapezoid profile.<\/li>\n
                                  2. Can be used in lift-off, rib, anti-dry etching, and other processes.<\/li>\n
                                  3. Different series of products to meet customer needs.<\/li>\n<\/ol>\n<\/div><\/div><\/div>
                                    <\/div><\/div><\/div><\/div><\/div><\/div>

                                    Photosensitive Polyimide (PSPI)<\/span><\/h3>\n<\/div>
                                    • <\/i><\/span>
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                                      EverPI\u00ae P Series<\/p>\n<\/div><\/li>

                                    • <\/i><\/span>
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                                      EverPI\u00ae N Series<\/p>\n<\/div><\/li><\/ul><\/div><\/div><\/div><\/div><\/div>

                                      • <\/i><\/span>
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                                        Features:<\/h4>\n<\/div><\/li><\/ul>
                                          \n
                                        1. Low curing temperature (180\u2103)<\/li>\n
                                        2. Good chemical resistance<\/li>\n
                                        3. Excellent adhesion to substrates<\/li>\n<\/ol>\n<\/div><\/div><\/div>
                                          <\/div><\/div><\/div><\/div><\/div><\/div>

                                          Photoresist Stripper<\/span><\/h3>\n<\/div>
                                          • <\/i><\/span>
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                                            EverSP 200 Series<\/p>\n<\/div><\/li><\/ul><\/div><\/div><\/div><\/div><\/div>

                                            • <\/i><\/span>
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                                              Features:<\/h4>\n<\/div><\/li><\/ul>
                                                \n
                                              1. NMP & DMSO free<\/li>\n
                                              2. Water soluble formulation<\/li>\n
                                              3. Low metal corrosion<\/li>\n<\/ol>\n<\/div><\/div><\/div>
                                                <\/div><\/div><\/div><\/div><\/div><\/div>

                                                Low Reflectivity Ink<\/span><\/h3>\n<\/div>
                                                • <\/i><\/span>
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                                                  IPR Series<\/strong><\/span><\/h1>\n<\/div><\/li><\/ul><\/div><\/div><\/div><\/div><\/div>
                                                  • <\/i><\/span>
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                                                    Features:<\/h4>\n<\/div><\/li><\/ul>
                                                      \n
                                                    1. UV or heat-curing process<\/li>\n
                                                    2. Automated production line<\/li>\n
                                                    3. Low reflectivity<\/li>\n<\/ol>\n<\/div><\/div><\/div>
                                                      <\/div><\/div><\/div><\/div><\/div><\/div>

                                                      LCD black side Sealant<\/span><\/h3>\n<\/div>
                                                      • <\/i><\/span>
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                                                        IBR Series<\/p>\n<\/div><\/li>

                                                      • <\/i><\/span>
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                                                        IPR Series<\/strong><\/span><\/h1>\n<\/div><\/li><\/ul><\/div><\/div><\/div><\/div><\/div>
                                                        • <\/i><\/span>
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                                                          Features:<\/h4>\n<\/div><\/li><\/ul>
                                                            \n
                                                          1. UV curing process<\/li>\n
                                                          2. Automated production line<\/li>\n
                                                          3. Realize high immersion<\/li>\n<\/ol>\n<\/div><\/div><\/div>
                                                            <\/div><\/div><\/div><\/div><\/div><\/div>

                                                            Compound Semiconductor Substrate Polishing<\/span><\/h3>\n<\/div>
                                                            • <\/i><\/span>
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                                                              ESA 301<\/strong><\/span><\/h1>\n<\/div><\/li><\/ul><\/div><\/div><\/div><\/div><\/div>
                                                              • <\/i><\/span>
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                                                                Features:<\/h4>\n<\/div><\/li><\/ul>
                                                                  \n
                                                                1. Ready to use<\/li>\n
                                                                2. Efficiency<\/li>\n
                                                                3. Regenerable<\/li>\n<\/ol>\n<\/div><\/div><\/div>
                                                                  <\/div><\/div><\/div><\/div><\/div><\/div>

                                                                  I-line Photoresist<\/span><\/h3>\n<\/div>
                                                                  • <\/i><\/span>
                                                                    \n

                                                                    EPI 630<\/p>\n<\/div><\/li>

                                                                  • <\/i><\/span>
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                                                                    EPI 673<\/p>\n<\/div><\/li>

                                                                  • <\/i><\/span>
                                                                    \n

                                                                    EPI 687<\/p>\n<\/div><\/li><\/ul><\/div><\/div><\/div><\/div><\/div>

                                                                    • <\/i><\/span>
                                                                      \n

                                                                      Features:<\/h4>\n<\/div><\/li><\/ul>
                                                                        \n
                                                                      1. High resolution<\/li>\n
                                                                      2. Excellent etching resistance<\/li>\n
                                                                      3. High thermal resistance<\/li>\n
                                                                      4. High photo speed<\/li>\n
                                                                      5. Wide process margin<\/li>\n<\/ol>\n<\/div><\/div><\/div>
                                                                        <\/div><\/div><\/div><\/div><\/div><\/div>

                                                                        Protect film Coating For Laser Dicing<\/span><\/h3>\n<\/div>
                                                                        • <\/i><\/span>
                                                                          \n

                                                                          HOC 6101<\/p>\n<\/div><\/li><\/ul><\/div><\/div><\/div><\/div><\/div>

                                                                          • <\/i><\/span>
                                                                            \n

                                                                            Features:<\/h4>\n<\/div><\/li><\/ul>
                                                                              \n
                                                                            1. Low curing temperature(60o\u00b0C)<\/li>\n
                                                                            2. High transmittance(T%>98)<\/li>\n
                                                                            3. Low consumption(low film thickness)<\/li>\n
                                                                            4. High temperature resistant laser cutting<\/li>\n
                                                                            5. Acid recasting resistant<\/li>\n
                                                                            6. Low alkalinity solution stripping<\/li>\n<\/ol>\n<\/div><\/div><\/div>
                                                                              <\/div><\/div><\/div><\/div><\/div><\/div>

                                                                              Protect film Remover<\/span><\/h3>\n<\/div>
                                                                              • <\/i><\/span>
                                                                                \n

                                                                                EGC 70<\/p>\n<\/div><\/li><\/ul><\/div><\/div><\/div><\/div><\/div>

                                                                                • <\/i><\/span>
                                                                                  \n

                                                                                  Features:<\/h4>\n<\/div><\/li><\/ul>
                                                                                    \n
                                                                                  1. Low alkalinity(NaOH<2%)<\/li>\n
                                                                                  2. Contains no boron, phosphorus or solvents<\/li>\n
                                                                                  3. Does not corrode metal<\/li>\n
                                                                                  4. Strong cleaning ability(Stripping HOC 6101 Time<60sec)<\/li>\n
                                                                                  5. No residue<\/li>\n<\/ol>\n<\/div><\/div><\/div>
                                                                                    <\/div><\/div><\/div><\/div><\/div><\/div><\/p>\n","protected":false},"excerpt":{"rendered":"","protected":false},"author":2,"featured_media":888,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"footnotes":""},"yoast_head":"\nSEMICON CHINA 2024 Focus - Everlight Chemical | Photoresists\uff0eDeveloper\uff0eSlurry | Electronic Chemicals<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/ecbu.ecic.com\/en\/2023touchtaiwan-focus\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"SEMICON CHINA 2024 Focus - Everlight Chemical | Photoresists\uff0eDeveloper\uff0eSlurry | Electronic Chemicals\" \/>\n<meta property=\"og:url\" content=\"https:\/\/ecbu.ecic.com\/en\/2023touchtaiwan-focus\/\" \/>\n<meta property=\"og:site_name\" content=\"Everlight Chemical | Photoresists\uff0eDeveloper\uff0eSlurry | Electronic Chemicals\" \/>\n<meta property=\"article:modified_time\" content=\"2024-03-20T08:07:15+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/ecbu.ecic.com\/wp-content\/uploads\/2024\/03\/banner1300x450px.jpg\" \/>\n\t<meta property=\"og:image:width\" content=\"1301\" \/>\n\t<meta property=\"og:image:height\" content=\"451\" \/>\n\t<meta property=\"og:image:type\" content=\"image\/jpeg\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Est. reading time\" \/>\n\t<meta name=\"twitter:data1\" content=\"175 minutes\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\/\/schema.org\",\"@graph\":[{\"@type\":\"WebPage\",\"@id\":\"https:\/\/ecbu.ecic.com\/en\/2023touchtaiwan-focus\/\",\"url\":\"https:\/\/ecbu.ecic.com\/en\/2023touchtaiwan-focus\/\",\"name\":\"SEMICON CHINA 2024 Focus - 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