2024 TOUCH TAIWAN 亮點產品

2024 TOUCH TAIWAN

Photoresist for Extra Low Temp. Process

  • EK 670

  • EOC 360

  • Features:

  1. Negative type photoresist for extra low temperature process. (post bake temp. 85℃)
  2. For flexible substrate. (COP、PET、PI ,etc.)
  3. For I-line and broad band exposure equipment.
  4. High resolution photoresists. (I-line)

OC Photoresist for Low Temp. Process

  • EOC 355

  • EOC 375

  • EOC 385

  • Features:

  1. Good adhesion after chemical resistance test.
  2. Good adhesion after moisture resistance test.
  3. Suitable for KOH type developer.

OC Photoresist for LED Sensor Application

  • EverPN 310

  • EverPN 320

  • Features:

  1. Good adhesion on Si wafer.
  2. Good adhesion after moisture resistance test.
  3. Good surface resistance.
  4. Good transmittance.
  5. Suitable for TMAH type developer.

FOPLP Photoresist

  • ECA 100 Series

  • EPP 200 Series

  • EverPI® P90 Series

  • Features of Photoresist for Plating:

  1. High Sensitivity
  2. High Aspect Ratio

  • Features of Photoresist for Dielectric:

  1. Low curing temperature (180℃).
  2. High resolution.
  3. Development with 2.38% TMAH.
  4. Good chemical resistance.
  5. Excellent adhesion to substrates.

ICP Process Photoresist

  • EPG 560 Series

  • EPG 5650 Series

  • Features:

  1. Good dry etching resistance.
  2. Apply to scribe line or mesa process.
  3. High resolution.

Lift-off Process Photoresist

  • ENPI 200 Series

  • ENPI 300 Series

  • Features:

  1. Wide PEB latitude.
  2. Can be stripped.
  3. Overhang can be changed by adjusted process condition.

Photosensitive Polyimide (PSPI)

  • EverPI® P09 Series

  • Features:

  1. Development with 2.38% TMAH.
  2. Good chemical resistance.
  3. High resolution.

Negative-Tone Photosensitive Polyimide

  • EverPI® NSA08

  • Features:

  1. Low curing temperature (180℃).
  2. Good chemical resistance.
  3. Excellent adhesion to substrates.

Photoresist Stripper

  • EverSP 200 Series

  • Features:

  1. NMP & DMSO free
  2. Water soluble formulation
  3. Low metal corrosion

Black side Sealant for curved monitor

  • IBR Seies

  • IPR Series

  • Features:

  1. Enviroment Friendly Green Adhesives: Solvent free system.
  2. Energy Saving : UV curing process.
  3. Reduce carbon emissions : Automated production line.
  4. Realize high immersion.

High Barrier UV-curing Sealants

  • IPR 8000 Series

  • Features:

  1. Solvent-free / Anti-yellowing / Chemical inertness.
  2. Protection for moisture-sensitive electronic devices.
  3. Adhesion for flexible/rigid/composite substrates.
  4. High transparency in the visible light range.